UHD-TMSA-010
- Tape mounter는 반도체 package 공정에서 wafer/LED PCB를 절단(sawing,dicing)하기 전 wafer/PCB와 ring(frame)을 UV tape으로 고정하는 장비
- 본 장비는 pre-cut tape을 사용하는 semi-auto type의 tape mounter로서 효율적이고 안정적인 작업을 수행.
| CATEGORIES | ITEM | SPECIFICATION |
| BASIC SPECIFICATIONS | Dimension Weight Color Painting Applicable Wafer Size Capacity | 940(W) x 1,300(D) x 1,550(H) mm 800 kg Silver & Gray Glossy Heat Drying Paint 6" / 8" / 12" (inch) 80 wafer/hrs |
| SOFTWARE | Environment | PLC |
| ACCURACY | Cutting Accuracy Alignment Accuracy | ≤ ± 0.3㎜ ≤ ± 0.3˚ |
| SERVICE | MTBF MTBA Up-tme Ratio Initialization Time | 1,200 hrs 200 hrs 99% 2 min |
| FACILITIES | Power Supply Air Pressure Air Consumption | AC 210~230V, 50 / 60Hz, Single phase 4 to 6 kgf/cm2 18 m3/min |