• UHD-AUV-020

  • Full Auto 저조도형 UV 장비로 반도체 및 LED sawing 후, UV tape을 curing해 UV tape의 접착력을 제거함으로써 이후 die attach 공정에서 효율성을 높여 주는 장비
CATEGORIESITEMSPECIFICATION
BASIC
SPECIFICATIONS
Dimension / Weight

Color

Painting

Applicable Wafer Size

Material Handling

Cassette / UV Chamber Quantity

UV Lamp Cooling

Environment

Tact Time

730(W) x 1200(D) x 1350(H) ㎜ / 400 kg

Gray & Dark Gray

Glossy Heat Drying Paint

8" / 12" (inch)

Auto

2 pcs / 1 piece

FAN Type

PC

200 EA / hr

UV CHAMBERReflection Mirror

UV Irradiation Measure Unit

Chamber Temperature

STS Mirror

GUVA-S10GM

Max. 30 ºC

UV LAMPType

Max. Lamp Output

Distance Between Lamp Electrodes

Lamp Quantity

Life Time

Wavelength

Low Illumination Mercury PL Lamp

40 W

400 ㎜

7 EA

500 hrs

UVA 365 ㎚

UV INTEGRATORIllumination

Deviation

Noise Level

Initialize Time

Return Initialize Time

12 ㎽/㎠ (Center)

±10 %

73 dB/㎠ (Max.)

30 sec

30 sec

FACILITIESPower Supply

Power Consumption

Main Breaker

Air Pressure

Air Consumption

Nitrogen Pressure

Exhaust Duct

AC 210~230V, 50/60 Hz, Single phase

5 kVA

30 A

0.5 to 0.8 MPa

18 m3/min or less

0.29 MPa

2.7 ~ 5.1 m3/min