UHD-TLM-000
![](http://u-hitec.co.kr/wp/wp-content/uploads/2017/07/Tape-Laminator-장비-UHD-TL-000.png)
- BG(Back Grinding) 공정은 반도체 wafer의 후면을 grinding해 package type에 맞게 두께를 설정하는 공정
- 이 때 완충작용을 통해 wafer 전면의 파손을 방지하고 표면오염을 방지하기 위한 보호 tape가 필요.
- 본 장비는 BG 전에 이 보호 tape를 wafer pattern 면에 접착하는 장비.
CATEGORIES | ITEM | SPECIFICATION |
BASIC SPECIFICATIONS | Dimension Weight Color Painting Operation Stage Temperature Center Table Section | 1,440(W) x 1,700(D) x 1,800(H) mm 800 kg Silver, Gray & Dark Gray Glossy Heat Drying Paint Manual Type by Button Room Temperature ~ 130℃ Contact |
APPLICABLE WAFER | Wafer Size Wafer Type Thickness | 6" / 8" (inch) Flat, V-notch450 ~ 800 ㎛ |
APPLICABLE TAPE | Tape Type Tape Size Tape Thickness Tape Consumption | Normal, UV Type 250 ± 0.2㎜ (8"), 330 ± 0.2㎜ (12") 100㎛ ~ 500㎛ ≤ 330 ㎜ / ea (12“) , 230 ㎜ / ea (8“) |
SYSTEM PERFORMANCE | UPEH *1 MTBF *1 | min. 70 ea/hr (12”) , 75 ea/hr (8”) min. 1,000 hr |
ACCURACY | Cutting Accuracy Alignment Accuracy | ≤ ± 0.3㎜ ≤ ± 0.3˚ |
FACILITIES | Power Supply Power Consumption Air Pressure Ambient Temp. Ambient Rel. Humidity | AC 210~230V, 50 / 60Hz, Single phase 1.5 kWh 5 to 6 kgf/cm2 20 ± 5℃ 60 ± 15% |