• UHD-AUV-010

  • 자동 고압 UV 장비로 반도체 및 LED sawing(dicing) 후, UV tape를 순간 curing 해 UV Tape의 접착력을 제거함으로써 이후 die attach 공정에서 효율성을 높여 주는 장비
CATEGORIESITEMSPECIFICATION
BASIC
SPECIFICATIONS
Dimension / Weight

Color

Painting

Applicable Wafer Size

Material Handling

Cassette / UV Chamber Quantity

UV Lamp Cooling

Environment

Tact Time

1160(W) x 910(D) x 1650(H) ㎜ / 700 kg

Gray & Navy

Glossy Heat Drying Paint

8" / 12" (inch)

Auto

2 pcs / 1 piece

Blower Type

PC

180 EA / hr

UV LAMPType

Voltage

Distance Between Lamp Electrodes

Lamp Quantity

Life Time

Wavelength

High Pressure Mercury Lamp

620 V

450 ㎜

1 EA

1,000 hrs

UVA 320~390 ㎚ (peak 350 ㎚)

UV INTEGRATORIllumination

Deviation

Noise Level

Initialize Time

Return Initialize Time

70 ~ 100 ㎽/㎠ (Center)

±20 %

73 dB/㎠ (Max.)

30 sec

30 sec

FACILITIESCommunication Protocol

Power Supply

Power Consumptions

Main Breaker

Air Pressure

Air Consumption

Nitrogen Pressure

Exhaust Duct

IMS, PIO in TCP/IP (for AGV)

AC 210~230V, 50/60 ㎐, Single phase

5 KVA

50 A

0.5 to 0.8 MPa

18 ㎥/min. or less

0.29 MPa

2.7 ~ 5.1 ㎥/min